Bubble Point Pressure of the Solutions of H2SiF6 + H2O and H2SiF6 + CO(NH2)2 + H2O from 323 K to 353 K Hou, C.H.; Wang, G.L.; Zhang, B.L.; Journal of Chemical & Engineering Data 2006, 51, 864-866
Data
wi = 0.2 g g-1
T (K) P (kPa)
323 11.84
328 15.03
333 19.01
338 23.79
343 29.9
348 37.34
353 46.11
377; urea + water; 00004:00169