Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compounds Flandorfer, H.; Saeed, U.; Luef, C.; Sabbar, A.; Ipser, H.; Thermochimica Acta 2007, 459, 34-39
Data
P = 101 kPa, x = 0 mol mol-1
T (K) Hmsol (kJ mol-1)
773 24.16
873 27.39
973 30.74
1073 34.45
27583; tin + copper; 03733:04492