Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compounds Flandorfer, H.; Saeed, U.; Luef, C.; Sabbar, A.; Ipser, H.; Thermochimica Acta 2007, 459, 34-39
Data
P = 101 kPa, wi = 0 g g-1
T (K) Hmsol (kJ mol-1)
773 -29.39
873 -22.77
973 -16.62
1073 -11.56
27584; nickel + tin; 04492:05229