Enthalpies of mixing of liquid Bi-Cu and Bi-Cu-Sn alloys relevant for lead-free soldering Flandorfer, H.; Sabbar, A.; Luef, C.; Rechchach, M.; Ipser, H.; Thermochimica Acta 2008, 472, 1-10
Data
Please code me!
27661; tin + copper + bismuth; 01063:03733:04492