Enthalpies of mixing of liquid systems for lead-free soldering: Cu-Sb-Sn system Jendrzejczyk-Handzlik, D.; Rechchach, M.; Gierlotka, W.; Ipser, H.; Flandorfer, H.; Thermochimica Acta 2011, 512, 217-224
Data
P = 101 kPa, T = 1100 K
x (mol mol-1) x (mol mol-1) HmE (kJ mol-1)
0.2404 0.2409 -0.999
0.2963 0.2955 -1.527
0.3043 0.3035 -1.592
0.3048 0.3055 -1.561
0.3127 0.3119 -1.527
0.3141 0.3148 -1.637
0.3212 0.3203 -1.598
0.3237 0.3244 -1.722
0.3289 0.3279 -1.648
0.3335 0.3342 -1.803
0.3386 0.3376 -1.795
0.2476 0.2482 -1.05
0.3437 0.3444 -1.91
0.3486 0.3476 -1.937
0.3591 0.3580 -2.09
0.3651 0.3659 -2.028
0.3714 0.3703 -2.239
0.3768 0.3776 -2.135
0.3821 0.3810 -2.239
0.3887 0.3896 -2.234
0.3948 0.3937 -2.243
0.4007 0.4016 -2.344
0.2551 0.2556 -1.113
0.4086 0.4074 -2.403
0.4131 0.4140 -2.437
0.4210 0.4198 -2.441
0.4259 0.4268 -2.518
0.4371 0.4359 -2.605
0.4387 0.4396 -2.597
0.4505 0.4492 -2.617
0.4508 0.4518 -2.68
0.4629 0.4639 -2.714
0.4649 0.4636 -2.708
0.2629 0.2635 -1.186
0.4749 0.4759 -2.78
0.4801 0.4787 -2.763
0.4872 0.4882 -2.849
0.4911 0.4897 -2.904
0.4995 0.5005 -2.974
0.5007 0.4993 -2.993
0.2709 0.2715 -1.249
0.2791 0.2797 -1.311
0.2873 0.2880 -1.412
0.2901 0.2892 -1.462
0.2959 0.2965 -1.461
27981; tin + antimony + copper; 02995:03733:04492