Enthalpies of mixing of liquid systems for lead-free soldering: Cu-Sb-Sn system Jendrzejczyk-Handzlik, D.; Rechchach, M.; Gierlotka, W.; Ipser, H.; Flandorfer, H.; Thermochimica Acta 2011, 512, 217-224
- Journal: Thermochimica Acta
- Sample Quantity(ies): Excess molar enthalpy
- Methodology: drop calorimetry
- Phase(s): Liquid
- Substances:
Data
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27981; tin + antimony + copper; 02995:03733:04492