Enthalpy of mixing of liquid systems for lead free soldering: Ni-Sb-Sn system Elmahfoudi, A.; Fürtauer, S.; Sabbar, A.; Flandorfer, H.; Thermochimica Acta 2012, 534, 33-40
Data
x (mol mol-1) P (kPa) T (K) HmE (kJ mol-1)
0.2130 101 1273.2 -9.592
27584; nickel + tin; 04492:05229